Bluetooth RF modules have been developed that measure a mere 0.276'' (7.0 mm) x 0.276'' (7.0 mm) x 0.071'' (1.8 mm) high, making them the industryÕs smallest such devices. And power dissipation for the modules is claimed to be one-third less than that of competitive devices.The breakthrough is attributed to the use of flip-chip assembly techniques and a unique low-temperature, co-fired ceramic substrate into which is embedded a filter, capacitor and inductors. The ultra-compact modules employ a Silicon Wave RF chipset that is said to deliver superb high frequency performance. The modules offer a Bluetooth 1.1-compliant Class 2 output (4 dBm max.), as well as offering compliance to Silicon Wave RF, Blue-RF, and other interfaces. They are also designed to operate with various clock frequencies, allowing designers to use existing application frequencies. Limited sampling starts this month, with production scheduled to start in June. For additional information and pricing, contact Mike Tanahashi at TAIYO YUDEN R&D CENTER OF AMERICA, San Jose, CA. (408) 573-4150, ext. 16.
Company: TAIYO YUDEN R&D CENTER OF AMERICA
Product URL: Click here for more information