EE Product News

Bluetooth Solution Plugs-And-Plays In SiP

The BGB202 takes a bow as the industry's first complete Bluetooth solution in a single, low-cost, plug-and-play device. Housed in a HVQFN semiconductor package, the chip integrates every element necessary for Bluetooth functionality--i.e., radio, baseband, ROM, filters, and other discrete components. The System-in-a-Package (SiP) measures just 7 x 8 mm and comes with state-of-the-art software up to HCI, including power control features and low power modes. The SiP is modeled after the PCF87852 Blueberry DATA ROM baseband IC, which includes an ARM processor, embedded ROM memory, Bluetooth core and UART, I2C, PCM/IOM, and JTAG interfaces. The BGB202’s radio function is based on a near-zero IF (N-ZIF) radio transceiver IC and includes a monolithic antenna filter for out-of-band blocking, a Tx/Rx switch, Tx and Rx baluns, VCO resonator, and basic power supply decoupling. Only an external clock and antenna are required for operation. BGB202 is sampling now with production slated for early Q2. ROYAL PHILIPS ELECTRONICS, San Jose, CA. (800) 234-7381.

Company: ROYAL PHILIPS ELECTRONICS

Product URL: Click here for more information

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