Chip-Scale Package Slashes UWB Footprint By 70%

Jan. 18, 2007
Staccato Communications says its Ripcord wafer chip-scale package offers the smallest form factor of any Certified Wireless USB-based solution available, reducing the space needed to implement an Ultra Wideband (UWB) wireless system in mobile products by

With a footprint of only 7.5 mm by 7.5 mm, the Ripcord WCSP (wafer chip-scale package) offers the smallest form factor of any Certified Wireless USB-based solution available, according to Staccato Communications. The device, based on the company's single-chip, all-CMOS SC3500 family, reduces the space needed to implement an Ultra Wideband (UWB) wireless system in mobile products by 70% (see the Figure).

Ripcord provides a complete, fully integrated solution for commercial applications of high-speed UWB at 480 Mbits/s. The high level of integration minimizes design risk, lowers system cost, and accelerates customers' time-to-market by consolidating all the required hardware and software components. With the advanced design of the Protocol Independent Kernel, the SC3500 family is extensible to support simultaneous operation of Certified Wireless USB, Bluetooth 3.0, and WiMedia's WiNET IP.

Designed to comply with the WiMedia Alliance's UWB common radio platform and the Certified Wireless USB specification from the USB Implementers Forum, Ripcord is implemented using a leading 110-nm digital CMOS process technology. Besides the WCSP version, the Ripcord SC3500 product family is available in a complete system-in-package (SiP) version. The Ripcord WCSP is expected to be available for general sampling later in Q1 2007. Early samples are available now through Staccato's lead customer program. Contact the company for price information. Check out www.staccatocommunications.com.

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