Electronic Design

Electronic Design UPDATE: October 19, 2005

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Electronic Design UPDATE e-Newsletter Electronic Design Magazine Electronic Design ==> www.electronicdesign.com October 19, 2005

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*************************ADVERTISEMENT************************** LabVIEW 8 - Discover Distributed Intelligence Easily design, distribute, and synchronize intelligent devices and systems with the new distributed intelligence of LabVIEW 8 from National Instruments. Whether you are testing electronics, mechanical structures, or dynamic systems, NI LabVIEW 8 equips you to tackle the most difficult test challenges with the ease and productivity of graphical development. Click here to view interactive demos and try LabVIEW 8 FREE online: http://news.electronicdesign.com/t?ctl=16C55:484C79 **************************************************************** Today's Table Of Contents: 1. Editor's View *Technology's Higher Purpose Is Education 2. Focus On Embedded *Green Hills And I-Logix Unify UML And IDE 3. News From The Editors *U.S. Senate Pressed To Add 60,000 H-1B Visas *Free Service Checks BOM For RoHS Compliance *Chips Move Time, Synchronization Data Over Packet Networks 4. Magazine Highlights: October 13, 2005 *Cover Story: Engineering Feature -- Weapons Of Mass Protection *Technology Report -- Packaging Rides The Z Axis Into The Third Dimension *Leapfrog: First Look -- Magnetoresistive RAM And Rad-Hard MCU Go To The Extreme *Leapfrog: First Look -- 10GbE MAC Streamlines Multiprotocol Traffic *Design View/Design Solution -- Carefully Weigh The Tradeoffs Of Cell-Based Vs. Structured ASICs Electronic Design UPDATE edited by Lisa Maliniak, eMedia Editor mailto:[email protected] **************************************************************** Think you know about FPGAs? Let Ed, the Electronic Design quiz host with the most, tickle your engineering IQ with our FPGA brain-teasing pop quiz brought to you by Actel. Do you know what FER and SER stand for? Come on over and take the quiz, and you may win a iPod! http://news.electronicdesign.com/t?ctl=16C59:484C79 **************************************************************** ********************** 1. Editor's View -- Exclusive to Electronic Design UPDATE ********************** Technology's Higher Purpose Is Education By Lisa Maliniak, E-Media Editor Every year, my daughter's school has a drive to collect gently used books for a neighboring low-income school district. Many of these children, we are told, do not have a single book to call their own. But even worse is that many children worldwide do not receive any education at all. Education is key to eradicating hunger, disease, and poverty in developing nations by improving agricultural productivity, health care, and business opportunities. It's also key to stabilizing the political and social structures of regions that find themselves in constant flux. Yet as of 2000, roughly 25% of the young-adult and adult populations of such nations were illiterate and without schooling. If allowed to persist, such conditions can only lead to further destabilization and to a wider gap between the haves and the have-nots, leaving entire societies without the means with which to dig themselves out of poverty. But technology can be a great facilitator of education, a great equalizer, and a great agent for empowerment. The United Nations' Millennium Development Goals initiative has a number of potentially far-reaching objectives. One of these is to ensure that children everywhere will have access to a full course of primary schooling by 2015. Such a goal is virtually unachievable without broad application of advanced technology. But the good news is that some large technology providers are already on board to help... Read the full article at http://news.electronicdesign.com/t?ctl=16C4F:484C79 **************************************************************** *************************ADVERTISEMENT************************** Samtec Interconnects: Rugged from the Outside In(tm) Samtec rugged interfaces include I/O and board level interconnects. I/O interfaces include AccliMate(tm) IP68 sealed circular and DataRate(tm) I/O high speed cable plugs and receptacles and a full line of modular jacks, D-subs and high-speed connectors. Rugged board-to-board interconnects include discrete wire, IDC, power, TigerEye(tm), one-piece and high-speed systems. http://news.electronicdesign.com/t?ctl=16C4A:484C79 **************************************************************** ********************** 2. Focus On Embedded ********************** ***Green Hills And I-Logix Unify UML And IDE Green Hills and I-Logix have combined their expertise to integrate Green Hills' Multi integrated development environment (IDE) with I-Logix's Rhapsody, an Object Management Group (OMG) unified modeling language (UML). This is more than just combining the two environments into a single package, though. It actually provides a two-way link between UML models and the C/C++ source code, as well as a link between the UML and Green Hills' Multi debugger. Any change made in the Multi C/C++ or Ada editor is reflected in the UML model, and vice versa. Integration extends throughout the development process. Rhapsody test vectors can be executed on the target hardware or in the Multi simulator. The combination can target Green Hills real-time operating systems and kernels, including Integrity and velOSity. This level of integration is a boon to embedded developers who use a development tool like Multi. Now, they can take advantage of model-driven development with Rhapsody while still retaining the low-level, hands-on feedback of Multi. The integrated version will be available from Green Hills. Green Hills Software ==> http://news.electronicdesign.com/t?ctl=16C5D:484C79 I-Logix ==> http://news.electronicdesign.com/t?ctl=16C5C:484C79 ********************** 3. News -- From The Editors ********************** ***U.S. Senate Pressed To Add 60,000 H-1B Visas The on-again, off-again H-1B visa battle is on again. Corporations, trade associations, universities, and others are besieging the U.S. Senate to increase the number of H-1B visa available by 60,000 per year for at least the next five years... Read the full article at http://news.electronicdesign.com/t?ctl=16C52:484C79 ***Free Service Checks BOM For RoHS Compliance Newark InOne has launched a free bill of materials (BOM) update service to help component buyers comply with Restrictions on Hazardous Substances (RoHS) legislation. BOMs are submitted through the BOM Upload feature on the company's homepage. An Excel spreadsheet or the sample template may be used, and the manufacturer or Newark InOne part number must be included for each part. Upon receipt, a member of the company's "Green Team" reviews and qualifies the BOM for service. This member also sets an update schedule with the customer. Updates are important because new RoHS-compliant parts are continually being added in the marketplace as the legislation's July 1, 2006 deadline approaches. After the BOM is "scrubbed" against a database of 4 million products, a generated quote indicates whether the part is RoHS compliant, whether the manufacturer part number is changing, and the number of substitutes available. Typically, the BOM is returned to the customer within two business days. Newark InOne ==> http://news.electronicdesign.com/t?ctl=16C5B:484C79 ***Chips Move Time, Synchronization Data Over Packet Networks Wide-area network and metro-area network carriers face a critical issue as they roll out their packet-based systems. Even "best effort" services cannot meet the timing requirements of video, gaming, Voice over Internet Protocol, and other services. Typically, expensive GPS receivers and T1/E1 connections step in to achieve the accurate synchronization for quality of service in packet systems. Or, designers can look to Zarlink Semiconductor's ZL30301 and ZL30302 Timing over Packet (ToP) chips... Read the full article at http://news.electronicdesign.com/t?ctl=16C4B:484C79 **************************************************************** *************************ADVERTISEMENT************************** Work Together Better with Adobe Acrobat 7.0 Teamwork just got easier. Combine multiple file types into a single, searchable document. Share critical information more securely. View and respond to project feedback seamlessly. And get everyone on the same page. Acrobat 7.0. Try it for free at adobe.com/collaborate and see how much more your team can do. Better by Adobe.(tm) http://news.electronicdesign.com/t?ctl=16C57:484C79 **************************************************************** ********************** 4. Magazine Highlights ********************** In case you missed them, here are some of the high points of our most recent issue. October 13, 2005: * Cover Story: Engineering Feature -- Weapons Of Mass Protection Homeland security looks to technology companies for innovative ways to combat potential terrorist strikes. http://news.electronicdesign.com/t?ctl=16C4C:484C79 * Technology Report -- Packaging Rides The Z Axis Into The Third Dimension Demands for lower-cost, higher-density, and smaller-footprint ICs aimed at portable electronics make 3D-packaging designers sweat. http://news.electronicdesign.com/t?ctl=16C4D:484C79 * Leapfrog: First Look -- Magnetoresistive RAM And Rad-Hard MCU Go To The Extreme This outer-space-capable RAM/MCU combo handles radiation levels of the highest degree. http://news.electronicdesign.com/t?ctl=16C4E:484C79 * Leapfrog: First Look -- 10GbE MAC Streamlines Multiprotocol Traffic By combining key building blocks, this media access controller simplifies 10-Gbit line-card designs. http://news.electronicdesign.com/t?ctl=16C53:484C79 * Design View/Design Solution -- Carefully Weigh The Tradeoffs Of Cell-Based Vs. Structured ASICs When all is said and done, the structured ASIC's shorter development cycle may well be the deciding factor for your design team. http://news.electronicdesign.com/t?ctl=16C51:484C79 For the complete Table of Contents, go to Electronic Design ==> http://news.electronicdesign.com/t?ctl=16C54:484C79 **************************************************************** Free Web Seminar: Advanced Verification For FPGA-Based Designs Wednesday, November 2, 2005 2:00 pm EST Today's FPGAs require hundreds of probes and weeks of work to debug in the lab. Often, that's still not enough. Join Electronic Design and Mentor Graphics for this free webcast as you learn how to create designs for advanced verification. Learn how to use assertions to view your design from the inside out and go places where probes could never go. Learn how transactors, constrained random testing, and coverage statements can increase verification confidence while reducing verification time. Register today: http://news.electronicdesign.com/t?ctl=16C49:484C79 **************************************************************** Free Web Seminar: TCAD Technology Tuesday, November 8, 2005 2:00 pm EST Through the use of TCAD simulation software and services, semiconductor companies can reduce product development cost and enhance process and device performance even before silicon is available. Join Electronic Design EDA Editor David Maliniak for a look at Synopsys' Sentaurus TCAD process and device simulation software during this live Web seminar. If you can't make it, don't worry. We'll have an archive live the next day. So register now! http://news.electronicdesign.com/t?ctl=16C48:484C79 **************************************************************** EiED Online -- Packing The PowerPC Embedded in Electronic Design (EiED) Online is your source for technical insight and hands-on reviews. Read Technology Editor Bill Wong's latest EiED Online column, "Packing The PowerPC." PowerPC microcontrollers deliver high performance but draw little power, making them ideal for embedded applications. Bill checks out AMCC's EP440C development kit, which encompasses a variety of different tools. http://news.electronicdesign.com/t?ctl=16C50:484C79 ********************** TAKE A POLL! Would you invest in a hybrid vehicle? -- Yes, they're great -- Someday, but the technology needs improvement -- Maybe in the future when the price comes down -- No, they'll never measure up to gas-powered vehicles -- Not sure Vote at Electronic Design ==> http://news.electronicdesign.com/t?ctl=16C5A:484C79 ****************************************************************

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CONTACTS: Electronic Design UPDATE e-NEWSLETTER

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Editorial: Mark David, Editor-in-Chief mailto:[email protected] Advertising/Sponsorship Opportunities: Bill Baumann, Publisher: mailto:[email protected]

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