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IEEE-1394 OHCI Link-Layer IC Cuts Cost Of Multimedia Systems

Final system costs for PCs with IEEE-1394 interfaces are said to be lowered by the TSB12LV23, an IEEE-1394 Open Host Controller Interface (OHCI) link-layer IC developed by Texas Instruments. The 1394 I/O subsystem suits multimedia applications such as digital audio and video. It complements TI's earlier TSB41LV02, a 400-Mb/s, two-port PHY chip.The TSB12LV23 conforms fully to the IEEE-1394-1995, -1394.a and -1394 OHCI 1.0 and PCI 2.2 specifications. It features deep FIFOs to support high-bandwidth traffic in PC applications and provides a seamless interface to TI's single- and multi-port PHY chips. To ease migration of designs from TI's first-generation OHCI-Lynx host ICs, the TSB12LV23 is pin-for-pin compatible with the TSB12LV22. By upgrading to the new device, designers can decrease system cost, reduce power consumption and improve performance.A number of features make the TSB12LV23 suitable for portable systems. It consumes as little as 10 µA and can retain the contexts necessary to support wake events. It implements the clock-run protocol, as defined by the PCI Mobile Design Guide, which allows the system clock to be slowed or stopped to save power. The device is also compliant with the PCI Power Management Specification, which supports low-power states. In addition to providing a PCI-to-1394 interface, the chip also supports CardBus-to-1394 applications. Packaging is a 100-pin TQFP.

Company: TEXAS INSTRUMENTS INC. - Semiconductor Group, Literature Response Center

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