AVX’s MLO Diplexers, based on patented multilayer organic high density interconnect technology, employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. Available in low profile 0805 (0.6 mm) and 0603 (0.5 mm) packages, the diplexers support multiple wireless standards, including WCDMA, CDMA, WLAN and GSM, and are ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS and cellular bands. The 0603 diplexers also support BT wireless standards. Boasting excellent solderability, low parasitics and high heat dissipation, the diplexers are also expansion matched to PCBs, improving reliability. Rated for use in temperatures from -40°C to +85°C, both diplexer packages feature a maximum power capacity of 4.5 W, are 100% tested for electrical parameters and visual characteristics, and are packaged on tape and reel. The 0603 diplexers measure 1.65 x 0.88 x 0.42 mm and are available in Ni/Au, Ni/Sn and OSP finishes. The 0805 diplexers measure 2.12 x 1.28 x 0.55 mm and are available in Ni/Sn, Immersion Sn, Immersion Au and OSP finishes.
MLO Diplexers Realize High Q Printed Passive Elements
Diplexers support WCDMA, CDMA, WLAN and GSM, and are ideally suited for band switching in WiFi, WiMax, GPS and cellular.