EE Product News

Qualcomm’s Embedded Module Enables Connectivity To Worldwide 3G/2G Networks

Tailored to notebook computers, the Gobi global mobile Internet embedded solution takes advantage of the high-speed mobile Internet services offered by network operators in virtually all parts of the world plus GPS. The embedded Gobi solution includes the company's MDM1000 chipset, associated software and API, and a reference design for a software-defined configurable data module supporting both EV-DO Rev. A and HSPA with full backward compatibility and GPS functionality. According to the company, by supporting both 3GPP and 3GPP2 standards, notebook computer manufacturers can deliver products with global connectivity capabilities while benefiting from greater efficiencies and a simpler user experience. For further information, call QUALCOMM INC., San Diego, CA. (858) 587-1121.

Company: QUALCOMM INC.

Product URL: Click here for more information

TAGS: Mobile
Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish