EE Product News

RF Plastic Packs Receive JEDEC Approval

Two packages for use in housing high-power RF LDMOS discrete transistors handling up to 65W have received JEDEC registration. The two RF power plastic packages are the TO-270 and TO-272. The TO-270 is a 2-lead package and the TO-272 is a 6-lead package with parallel source leads for flexibility of mounting options. Both packages are designed for automatic insertion handling. The gold-free packages offer IC-like lead coplanarity with solderable leads and copper heatsink built in. The packages will be available on a number of RF LDMOS transistors planned for year 2000.

Company: MOTOROLA SEMICONDUCTOR PRODUCTS SECTOR (SPS)

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