Capable of operating at 12.5 Gbps, the S3095 integrated transimpedance amplifier (TIA) and automatic gain control amplifier (AGC) is targeted for use in OC-192 SONET/SDH-based dense wave division multiplexing (DWDM) and time division multiplexing (TDM) applications. Among the device's features expected to help it realize design-wins in the OC-192 market are: a wide, 28-dB dynamic range; a high gain, represented by 4 Kiloohms of transimpedance; and power dissipation of less than 900 mW. The chip also offers a linear output that provides added application flexibility and enables decision threshold adjustment in DWDM links. In addition, the 10-GHz bandwidth SiGe device boasts of low input noise, seamless interfacing to the company's S3092 demux device, and an adjustable output DC offset for providing an adjustable decision threshold at the input stage of the S3092 demux. And it enables receiver sub-modules to be built for use in both FEC and non-FEC applications. The chip comes in die form.