The BCM4322, the newest member of the Broadcom Intensi-fi family, is a full-featured, single-chip IEEE 802.11n solution. The highly integrated chip is the first to enable Wi-Fi products to achieve over 200 Mbits/s of actual wireless throughput, according to Broadcom. The chip combines an 802.11 medium access controller, a baseband processor, 2.4- and 5-GHz radios, and other WLAN components onto one silicon die. This high level of integration can reduce manufacturing costs by up to 40%. In addition, the smaller footprint allows designers to add Wireless LAN capabilities to consumer products that have never had such functionality, including televisions, set-top boxes, and camcorders. This will allow users to seamlessly move video and audio content throughout their home or office.
The use of a 65-nm process technology creates a chip that is less than half the size of multi-chip 802.11n solutions and consumes up to 50% less power. The chip is the second generation of Intesi-fi technology and complies with 802.11n draft 2.0. It uses a unique architecture that delivers a maximum data rate of 300 Mbits/s. It also employs innovative techniques to increase the reliability of wireless connections, as well as the network’s coverage area.
The BCM4322 is sampling now, with production quantities expected to ship in the first quarter of 2008. Prices are available on request. For more information, go to www.broadcom.com.