Adhesive Exhibits High Thermal Conductivity

    May 20, 2010
    MT-815 can be used in a variety of applications including as a thermal adhesive for large die in device-attach applications or as a solder replacement.

    Addressing the need for a more flexible, high thermal conductivity adhesive, MT-815 can be used in a variety of applications including as a thermal adhesive for large die in device-attach applications or as a solder replacement. It has a modulus of less than 1 GPa and achieves a thermal conductivity greater than 10 W/m-K. For further information and price, call LORD CORP., Cary, NC. (877) 275-5673.

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