BGA Heatsinks Sport Elliptical Fins

Designed for newer BGA and other SMT chipsets that operate at higher speeds and power requirements, the company’s latest BGA heatsinks exploit an elliptical fin design that makes them most efficient in lower airflow environments where multiple heatsinks are used in series. The fins are said to be large and exhibit lower pressure drop characteristics, ensuring optimal cooling performance. The heatsinks easily attach to the chipset via a removable clip and require no modifications or accessories. They are available in 10 body sizes: 21 mm, 23 mm, 25 mm, 27 mm, 31 mm, 35 mm, 37.5 mm, 40 mm, 42.5 mm, and 45mm. Each body size is available with thermal-resistance characteristics of 100, 200, 300, 500, and 700 lfm. Pricing starts at $68 for a five pack with delivery from stock to five days. EMULATION TECHNOLOGY, Santa Clara, CA. (800) 232-7837.