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    1. Technologies
    2. Components

    Ceramics For High-Power Packages

    July 26, 2011
    Newer power RF semiconductor technologies are enabling higher power levels in smaller device sizes, making packaging materials a real concern. Beryllium oxide (BeO), aluminum nitride (AlN), and alumina (Al2O3) are good thermal conductors, and BeO has long been the ceramic of choice for microelectronics packages through about 4 GHz.

    Modern high-power RF semiconductors produce extremely high power densities, calling for packing materials with excellent thermal qualities to effectively dissipate the heat. Learn how to sort through different high-power package materials and how beryllium oxide (BeO) compares to other package material options.

    Download the PDF here.

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