CMOS Oscillators Come In Package And Die Form

May 13, 2010
Supposedly a first, the MM8202 and MM8102 all-silicon CMOS oscillators are available in both wafer and package forms.

Supposedly a first, the MM8202 and MM8102 all-silicon CMOS oscillators are available in both wafer and package forms. The wafer form versions enable chip-on-board (CoB) and multi-chip module (MCM) assembly designs. The MM8202 and MM8102 are both built on standard CMOS technology and do not require any mechanical frequency references, be it quartz or MEMS. Frequency accuracy is lower than 300 ppm for the MM8102 and both devices consume an active power of 2 mA typical at 1.8V. Prices range from $0.52 to $0.59 each/1,000. INTEGRATED DEVICE TECHNOLOGY INC., Santa Clara, CA. (800) 345-7015. 

Sponsored Recommendations

Near- and Far-Field Measurements

April 16, 2024
In this comprehensive application note, we delve into the methods of measuring the transmission (or reception) pattern, a key determinant of antenna gain, using a vector network...

DigiKey Factory Tomorrow Season 3: Sustainable Manufacturing

April 16, 2024
Industry 4.0 is helping manufacturers develop and integrate technologies such as AI, edge computing and connectivity for the factories of tomorrow. Learn more at DigiKey today...

Connectivity – The Backbone of Sustainable Automation

April 16, 2024
Advanced interfaces for signals, data, and electrical power are essential. They help save resources and costs when networking production equipment.

Empowered by Cutting-Edge Automation Technology: The Sustainable Journey

April 16, 2024
Advanced automation is key to efficient production and is a powerful tool for optimizing infrastructure and processes in terms of sustainability.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!