Irvine, California: Microsemi Corp. has created a design guide for developing next-generation, high-voltage, high-power systems based on the company’s digital radio frequency (DRF) family of hybrid modules.
These systems are used in applications including semiconductor processing, LCD glass coating, solar cell manufacturing, optical device and architectural glass coating, hazardous gas treatment, CO2 laser excitation, MRI RF amplifiers, RF scalpels, and induction heating systems.
The modules combine RF driver ICs and power MOSFETs in a single package capable of delivering 1 to 3 kW at frequencies up to 40 MHz. The design guide also provides system developers with RF design techniques related to component selection, matching network design, output power optimization, efficiency maximization, cooling, and packaging, as well as recommendations related to circuit topologies required for building a complete RF generator.
The company’s DRF product family combines up to two RF driver ICs, two RF power MOSFETs, and associated decoupling capacitors in a single package. According to Microsemi, the close proximity of the driver IC and MOSFET cuts circuit inductance and enables a variety of circuit configuration and system topologies.
Designed to deliver continuous power, Class D and E, and pulsed-power applications, the modules can launch up to 3 kW of RF power while requiring only 5-V logic level input signals.