With a thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60°F to 400°F, EP21ANHT two-part epoxy is viable for use in demanding microelectronic applications. The cured adhesive is also a reliable electrical insulator. EP21ANHT has a coefficient of thermal expansion of 18-20 in./in. x 10-6/ºC, a dielectric strength of greater than 400 V/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.