This high thermally conductive phase change material comes in thicknesses from 0.005" to 0.020". The T-pcm 700/900 material has a thermal conductivity of 1 to 3 W/m-°C. When heated to 50°C and under pressure as low as 5 psi, it flows to fill the microscopic irregularities of both heatsink and IC package surfaces to reduce interface resistances to as low as 0.05°C-in.2/W. The material is flexible but solid at a temperature of 23°C, so it is easy to handle and apply using normal manufacturing techniques.
Company: THERMAGON INC.
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