MALVERN, PENNSYLVANIA—November 7, 2006
Vishay Intertechnology, Inc. (NYSE: VSH) will be presenting over two dozen different product demonstrations at the electronica 2006 show, to be held November 14 – 17 at the New Trade Fair Center in Munich, Germany. The demonstrations will highlight performance characteristics of a number of Vishay discrete semiconductors and passive electronic components. The electronica trade show, held every two years in Germany, presents the world’s largest range of electronic components and application-oriented assemblies. Vishay will be participating at electronica 2006 with exhibits at four locations within the New Trade Fair Center:
Main Booth: A5.143 Solutions Booth: A5.142? Automotive Innovation Booth: A6.A55? Wireless Communications Booth: A4.W14
"Vishay’s product demonstrations are an essential part of our presence at electronica 2006," stated Dr. Felix Zandman, Vishay’s Chairman and Chief Technical and Business Development Officer. "They use key technical criteria to show how Vishay components, a number of which utilize patented or industry-best technology, outperform competing components. As a group, our product demonstrations indicate the breadth and depth of Vishay’s extensive product portfolio, which is one of the industry’s broadest."
All Vishay product demonstrations will be held at electronica’s Main Booth (A5.143), except for the demonstration of Vishay’s wireless JetWeigh-W™ Aircraft Weighing System at Booth A4.W14. Below is a complete list of the demonstrations:
Demo Stand 1: Power ICs, Analog Switches, and DC/DC Converters • Complete Integrated 10-A DC/DC Power Supply Second-generation FunctionPAK® increases power output, lowers part count, and saves space • 500-kHz Isolated DC/DC Converter with Secondary Synchronous Rectification Simple two-chip solution
Demo Stand 2: Power MOSEFTs • High- and Low-Side MOSFETs Utilizing Double-Sided Cooling in Synchronous Buck Circuit Comparison Side-by-side comparison using identical test conditions: the efficiency of the Vishay PolarPAK® is compared to competition • Co-Packaged High- and Low-Side MOSFET and Integrated Driver in Synchronous Buck Circuit Comparison Side-by-side comparison using identical test conditions: the efficiency of the Vishay PowerPAK® MLF is compared to competition • Monolithic Low-Side MOSFET and Integrated Schottky in Synchronous Buck Circuit Comparison Side-by-side comparison using identical test conditions: the efficiency of the Vishay SkyFET™ is compared to competition • ThermaSim™ Complete thermal simulation tool
Demo Stand 3: Optoelectronics • IrDA® vs. Bluetooth® Wireless Communication IrDA’s VFIR outperforms Bluetooth on speed, ease-of-use, and security • New TSOP98200 IR Sensor for Code Learning and IR Extender Operations The new Vishay TSOP98200 can transfer any IR code from external consumer devices to a Microsoft® Windows® Media Center computer
Demo Stand 4: Diodes and Rectifiers • Trench vs. Planar Schottky Rectifier Comparison Vishay TMBS™ reduces heat generation in high-frequency operation • TVS Overvoltage Clamping Power Capability Miniature TPSMP transient voltage suppressors (TVS) offer the highest power clamping capability among products of similar package sizes • Overvoltage Clamping Using ESD Protection Diodes Comparison of different overvoltage clamping modes
Demo Stand 5: Resistors and Strain Gages • Thin Film Resistors Pulse Loads on SMD Resistors Pulse Load Handling: Pulse loads such as a single energy pulse or a continuous flow of pulses are an increasingly important factor in professional electronics • Thin Film Resistors Fuse Endurance Tester The endurance and reliability of fuses are important factors in the design of safe and reliable electronics devices • Bulk Metal® Foil Resistors Demonstrations - Power Coefficient of Resistance (PCR): "ΔR due to self heating" for foil resistors - Electrostatic Discharge (ESD): Resistance change due to high voltage spikes - Short-Time Overload: Permanent resistor change due to overload conditions - Power Coefficient for Current Sense Resistors - Power Coefficient Tracking for Voltage Dividers and Networks • PC Board Strain Measurement Strain gage testing allows objective analysis of strain rate and the strain to which surface-mount components are subjected
Demo Stand 6: Resistors • WSL Thermal EMF Demonstration Thermal EMF (or Seeback Effect) is caused when dissimilar metals are joined such as in resistor contacts to the PCB • WSL PCR Demonstration Power Coefficient of Resistance (PCR) is resistance change caused by self-heating of a resistor induced by applied power • WSH Pulse Performance Demonstration Pulse performance of a resistor is characterized by the resistor’s ability to effectively dissipate heat energy from the applied pulse and maintain a reliable resistance value
Demo Stand 7: Inductors • IHLP – Power Inductor with Soft Magnetic Saturation for High-Current Applications Comparing power inductor saturation current • IHLP – Low-Audible-Noise/High-Power Inductor Comparing magnetostrictive noise in power inductors • IHLP – Best DC/DC Converter Efficiency Comparing power inductor efficiency in dc-to-dc conversion
Demo Stand 8: Capacitors • 450-V, 25-mm x 40-mm Aluminum Capacitor Handles 20-A Ripple Current Showcasing Vishay’s manufacturing capabilities, the 100 PTR-SI series is demonstrated • Vishay’s 572D Tantamount® Capacitors for Audio Applications Superior sound quality: You can hear the difference! • HVArc Guard™ Capacitors Prevent Surface Arc-Over Using a high-speed camera to detect arc-over when DC is applied at 500 V/s, HVArc Guard capacitors and competing capacitors are tested Wireless Communications Demo (Booth A4.W14): • Wireless JetWeigh-W™ Aircraft Weighing System Accurate, high-reliability, robust, and easy-to-use wireless aircraft weighing system
More information on the Vishay product demonstrations at electronica 2006 is available here .