The LP500 series of low-profile, micro-cold forged coolers is designed to cool both Intel and AMD microprocessors. The series is also designed to surpass the microprocessor manufacturers' acceptable heat dissipation criteria for devices that include: Intel Celeron PPGA and Flip Chip from 533 to 700 MHz; Coppermine to 933 MHz; and AMD Duron to 700 MHz. The heatsinks use either 50 x 10 mm or 60 x 12 mm coreless fans that provide 50,000 hr. MTBF.
Company: COFAN USA
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