Electronic Design

Low Viscosity Epoxy Meets FDA/USP Class VI Requirements

Trimmed for potting and encapsulation applications, EP21LV low viscosity epoxy conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements. With a 1-to-1 mix ratio by weight or volume, it cures at room temperature in 24 to 36 hours or faster at elevated temperatures. Uniquely, rigidity can be altered by adjusting the mix ratio, i.e., adding more of Part A yields a more rigid cure with enhanced machinability. Switching to a 1-to-2 mix ratio yields a more forgiving cure with improved impact resistance. Serviceable over a temperature range of -65°F to +250°F, working life is 60 to 75 minutes for a 200-gram mass. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.

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