EE Product News

ML Chip Suppressor Has Nickel Barrier Termination

A process has been developed that permits, reportedly for the first time, the termination of multilayer (ML) ceramic varistor chips with a nickel barrier, which is said to overcome solderability and solder leaching problems that existing products with silver-based terminations can encounter. The new ML transient voltage suppressors terminated using a nickel/tin process are said to prevent solder leaching and also to provide improved solder fillet height levels of 50% to 70% of overall device height versus the 30% to 50% generally achieved with existing silver-based termination suppressors. The ML Series of transient voltage surge suppressors comes in 0603 and 0805 chip sizes and have a wide operating temperature range (-55°C to 125°C) and wide operating voltage range (3.5V to 120V).

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