Electronic Design

Reworkable Adhesive Improves Thermal Performance, Eliminates Underfill

The UA-2605 reworkable edgebond adhesive promises to improve thermal cycle performance of CBGAs and plastic BGAs. In one case, it tripled the 0°C to +100°C performance of a CBGA to nearly 2500 cycles. Normally, an underfill is necessary to achieve this performance, however the edgebond adhesive is allegedly much easier to process than an underfill.  ZYMET INC., East Hanover, NJ. (973) 428-5245.

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