Electronicdesign 5191 Xl tecircuit 3
Electronicdesign 5191 Xl tecircuit 3
Electronicdesign 5191 Xl tecircuit 3
Electronicdesign 5191 Xl tecircuit 3
Electronicdesign 5191 Xl tecircuit 3

Silicon ESD Devices Drop Insertion Loss To Lowest Levels

Feb. 21, 2012
Ultra-low-capacitance demarcates TE Circuit Protection’s new family of single- and multi-channel silicon ESD (SESD) protection devices

Ultra-low-capacitance demarcates TE Circuit Protection’s new family of single- and multi-channel silicon ESD (SESD) protection devices. The low capacitance (0.10-pF  typical for bidirectional; 0.20-pF typical for unidirectional) results in very low insertion loss, which is essential for maintaining signal integrity in applications using the highest-speed interfaces, such as USB 3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt. The devices help protect against damage caused by electrostatic discharge (ESD), surge and cable discharge events. Other features include a 20-kV contact and air-discharge rating, and miniature packaging (single-channel: small-footprint 0201- and 0402-sized XDFNs; multi-channel: two-, four, and six-channel options with a 0.31-mm height).

TE CIRCUIT PROTECTION (a business unit of TE CONNECTIVITY)

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