Electronic Design
Silicone Encapsulant Takes The Heat

Silicone Encapsulant Takes The Heat

Designed for applications where high heat dissipation is required, the SC-305 two-part silicone encapsulant can be room-temperature or heat cured for maximum adhesion. Exhibiting low stress, high thermal conductivity, and high environmental resistance, it’s composed of an addition-curing polymer that will not depolymerize when heated in confined spaces. SC-305 also meets the requirements of UL 94 V-O and its three-step application process involving mixing, applying and curing is user-friendly. LORD CORP., Cary, NC. (877) 275-5673.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish