Electronic Design
Thermoelectric Assemblies Enter Next Generation

Thermoelectric Assemblies Enter Next Generation

Featuring a compact design with higher cooling performance and less power consumption, the next gen Tunnel Series thermoelectric assemblies employ patented cross flow technology to boost heat transfers when pulling air through a heat exchanger. Heat is absorbed and dissipated through a high density heat sink with sheet metal shrouds and fans. The components are available in two configurations: air-air using convection cooling to absorb and dissipate heat via heat exchangers with fans and direct-air conduction cooling to absorb heat through a cold plate. LAIRD TECHNOLOGIES THERMAL PRODUCTS, Cleveland, OH. (888) 246-9050.
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