Electronic Design

Underfill Suits POP Assembly

CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies.  It has low viscosity and a lower CTE than its predecessors plus greater flux compatibility, making it suitable for use with a broader range of solder pastes and tacky fluxes. Features include a viscosity of 650 cps and a CTE of 55 ppm/°C. ZYMET INC., East Hanover, NJ. (973) 428-5245.

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