Keeping in step with the oncoming transition from PCI Express Mini Cards to slim M.2 solutions, TE Connectivity developed a series of next-generation form-factor (NGFF) connectors that meet the new interface standard’s size and volume requirements. The devices come with either a standard top printed-circuit-board (PCB) mount or a midplane (offset) PCB mount. Their dense form factor has a 0.5-mm pitch, and maintains 67 positions. They support PCI Express 3.0, SATA 3.0, and USB 3.0. Compared to the PCIe Mini Card, connector height is reduced by 15%. The connectors also save more than 20% of PCB space. Both single- and double-sided modules are supported. Applications include solid-state drives and wireless cards for notebooks, ultraportable devices, tablets, desktops, and servers.
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