Over the last decade, 2G/3G RF front-end designs have evolved to a mature and relatively efficient state, with little innovation over the last few years. Instead, with the rollout of LTE networks on the horizon, the race was on for chip vendors to develop their LTE baseband modem and transceiver chipsets. Today most of the chipset challenges have been addressed, with all the major vendors releasing viable products for the first wave of 4G handsets onto the market.
Register to view the full article
By registering on Electronic Design now, you'll not only gain access to premium content, you'll also become part of a robust engineering community. Gain access to the complete 2016 Salary & Career Report when you register now.
Joining the Electronic Design community also allows you to:
Become a member of a group of exclusive Engineers
Participate in Expert and Reader driven Q&A's
Start your own conversation by commenting on any article or blog
Communicate and network with other Engineers from all over the world
Gain access to high-quality content
Already a member? Log in.