Audio SoC Enables Heatsink-Free Systems

May 25, 2011
The STA350BW Sound Terminal digital audio system-on-chip (SoC) forecasts slimmer home audio designs and embarks as the first device of its type supporting systems with up to 50W of output power with no external heatsink required.

The STA350BW Sound Terminal digital audio system-on-chip (SoC) forecasts slimmer home audio designs and embarks as the first device of its type supporting systems with up to 50W of output power with no external heatsink required. Like other devices in the Sound Terminal family, it integrates digital audio processing and Multiband Dynamic Range Compression (MDRC) and can compensate for non-ideal speaker characteristics. The device’s power stage uses FFX technology to stream full digital audio to the speakers. This provides four selectable run-time output configurations supporting a choice of operating modes including 2.0, 2.1, or 1.0 channel, or 2.0-channel with a PWM output for an external subwoofer. Available in a Power SSO36 package, price for the STA350BW is $4.50 each/1,000. STMICROELECTRONICS, Lexington, MA. (888) 787-3550.

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