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Logic Devices Occupy LFBGAs (3)

Providing smaller, more compact designs, Integrated Device Technology, Philips Semiconductors and Texas Instruments have jointly decided to source several logic devices with the same functionality and pinouts in the space saving, low-profile, fine-pitch ball grid array package (LFBGA). For limited space applications such as wireless telephone systems, base stations, networking systems, memory modules, PCs and handheld computers, the logic devices provide multiple sources for products to help speed time-to-market with secure second-source procurement. The first devices include the 74LVCH32244 32-bit unidirectional transceiver, 74LVCH32245 32-bit bidirectional transceiver, 74LVCH32373 32-bit latch, 74LVCH32374 32-bit flip-flop, and 74ALVCH32501 36-bit registered transceiver. The first four devices occupy 96-ball packages and the 36-bit device, a 114-ball package. See “Logic Devices Occupy LFBGAs (1)” and “Logic Devices Occupy LFBGAs (2)”

Company: TEXAS INSTRUMENTS INC. - Semiconductor Group, Literature Response Center

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