A chip-scale packaging technology for RF functions, Tessera's Pyxis promises to be a lower-cost, more compact alternative to ceramic and laminate approaches. Pyxis combines the company's µBGA technology with flip-chip assembly, integrated passives in silicon and on polyimide tape, as well as novel EMI shielding techniques to achieve higher levels of RF integration. The company will license this technology and offer related RF services, design tools, and libraries. For more, see www.tessera.com.
National Semiconductor has launched a free online resource to educate designers on a range of analog topics. The company's Analog University offers an interactive, self-paced multimedia learning environment in which designers with different skill levels can enhance their knowledge of analog design. Courses include amplifiers, audio, data conversion, displays, low-voltage differential signaling, power management, thermal management, and wireless. Further details can be found at www.national.com.
By widening the output current tolerance to ±25% on its LinkSwitch power-conversion IC, Power Integration further reduced the cost of building low-power switching power supplies. The LNK500 costs $0.31 per unit in million-piece quantities versus $0.37 for the original LinkSwitch IC, the LNK501. The relaxed tolerance takes advantage of the loose output current characteristic found in the linear ac-dc adapters and battery chargers that LinkSwitch aims to replace. Visit www.powerint.com.