Fairchild Puts On A Power Display At PCIM

May 7, 2012
Fairchild Semiconductor demonstrated a range of power solutions at PCIM, featuring silicon and solutions for industrial power, automotive, LED lighting, and dc-dc conversion.

PCIM 2012 Nuremberg: Fairchild Semiconductor demonstrated a range of power solutions at PCIM, featuring silicon and solutions for industrial power, automotive, LED lighting, and dc-dc conversion.

In terms of industrial power-supply solutions, the company unveiled the FGA40N65SMD and FGA60N65SMD 650V Field Stop IGBTs. They feature high current-handling capability, positive temperature coefficient, tight parameter distribution, and a safe operating area. Other demonstrations at the show included an advanced 2.5A output-current gate-drive optocoupler. It employs Fairchild’s Optoplanar packaging technology and optimised IC design to achieve reliable and high insulation voltage, as well as high noise immunity.

Automotive solutions on display included Fairchild’s latest gate-driver ICs, the FAN7171 and FAN7190. According to the company, the HVIC gate drivers deliver an integrated inverter solution that boosts efficiency, drive current, and noise immunity for hybrid and electric vehicles. Also on display were the FDDS100H06_F085, FDBS09H04A_F085A, and FDDS10H04_F085A smart high-side switches. Designed with an N-channel power FET, these devices feature a charge pump, current-controlled input, and diagnostic feedback specifically designed to address advanced electrical load control in automotive body electronics. 

Responding to growing industry demand, Fairchild developed LED lighting solutions that support multiple dimming platforms, achieve high power factor, and provide thermal protection. For instance, the FL7730 single-stage primary-side-regulation (PSR) controller achieves dimming control without flicker over the full range of 0% to 100% light output. Also on display was the FL7701 smart non-isolated PFC buck LED driver.

In addition, the company introduced dc-dc conversion solutions that address the need for increased power density within devices requiring minimal space design. 

http://www.fairchildsemi.com/engineeringconnections

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