A center-probe test socket for devices up to 13 mm wide, with pitches of 0.50 mm and higher, operates from 1 to 10 GHz. Designed for CSP, MicroBGA, MLF, QFN, DSP, LGA, DRAM, and flash packages, it features a signal path during test of only 0.77 in. for minimum signal loss (at 11 GHz and a 0.50-mm pitch, bandwidth is −1 dB).
A four-point spring-probe crown ensures scrub-on solder-ball oxides for reliable contact mating. Additionally, the socket uses solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless-steel screws.
Center-probe contact forces are 9 to 12 g per contact for pitches from 0.50 to 0.75 mm and 17 to 20 g per contact for 0.80-mm pitches and larger. It operates from −55°C to 150°C. Spring probes are made of a heat-treated beryllium-copper alloy, plated with 30 µin. of gold minimum per MIL-G-45204 over 30 µin. of nickel per QQ-N-290. All socket components are made of UL94V0-0 or Torlon materials. All hardware is made of stainless steel.
Pricing for a 100-lead molded ball-grid-array socket (for up to 3 GHz) starts at $450 each in quantities of one to four pieces. Delivery is within two weeks.
Aries Electronics Inc.