The IN581AMB advanced memory buffer provides the interface between the highspeed serial interface defined for highcapacity memory arrays and industry-standard DDR2 SDRAMs. The chip fully complies with the JEDEC AMB specifications for fully buffered dual-inline memory modules (DIMMs). It also maximizes performance of the high-speed, serial, point-to-point connection between the memory controller and the modules on the channel. Part of the company's ExacTik family, the IN581AMB claims the industry's smallest die size, lowest latency, and lowest power—15% to 20% less than the typical 6 W associated with other AMB chips. The chip also includes advanced features such as a per lane high-speed pattern generator and BERT testing. With that combination,-designers can create some of the highest-performing systems in the world. The IN581AMB is available immediately. In sampling quantities, it costs about $23 each.