The Endur-IC family of mobile double-data-rate (DDR) memory chips feature multiple densities. The chips' internal architecture delivers aggressive power specifications, high bandwidth, and increased reliability over standard SDRAMs. The memories can operate over the full industrial temperature range of 40°C to 85°C. They also can employ the company's stacked DRAM process to deliver shorter latencies, higher speeds, and the industry's lowest standby current (as little as 140 µA at 1.8 V and 45°C). Temperature-compensated self-refresh automatically adjusts the refresh rate to compensate for internal temperature changes. Partial-array self-refresh lets users control refresh conditions to extend battery life. The Endur-IC memories are available in 128-, 256-, and 512-Mbit capacities with all three available in 16-bit wide organizations and in 60-contact fine-pitch BGAs. The 512-Mbit device also comes in a 32-bit wide option. Contact the company for volume pricing.
Micron Technology Inc.