Built on a process platform jointly defined by LSI Logic and Taiwan Semiconductor Manufacturing, G90 devices can tap a broad a spectrum of standard cell, I/O and PLL libraries, cores, memories, intellectual properties (IPs), and other circuitry to construct a system-on-a-chip (SoC) capable of delivering up to 800 MHz of embedded performance. Compatible with the Taiwanesse manufacturerÕs 90-nm CMOS process design rules, G90 SoC devices are architected using a design system called FlexStream that can significantly accelerate time-to-market and increase chip integration levelsÑup to 64 million logic gates and 100 Mb of 6T-SRAM can be integrated onto a chip. System-level functionality is also increased. Here are some of the performance ratings that LSI Logic reports can be realized with the new SoCs: operation with a power supply of just 1V, with 1.2V optional for mixed-signal designs; I/O power supply of 3.3V with 5V tolerance, as well as 2.5V, 1.8V and 1.5V; triple oxide option to support high-speed I/O standards; performance and density optimized memory; power dissipation of just 2 nW/gate/MHz; and dedicated thick metal layers for power grid routing.The new technology is also accompanied by a raft of advanced packaging schemes. And the FlexStream fully integrated design environment is said to help deliver complex ASICs and SoCs with what LSI Logic calls Right-First-Time results. For more G90 information, contact LSI LOGIC CORP., Milpitas, CA. (866) 574-5741.
Company: LSI LOGIC CORP.
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