Accommodating devices measuring up to 13 mm2 with pitches of 0.5 mm and greater, the company's new RF test sockets target applications with operating speeds from 1 GHz to greater than 10 GHz. Supported packages include CSP, MicroBGA, MLF, QFN, DSP, LGA, SRAM, DRAM, and flash devices. The socket's test signal path measures 1.95 mm and its four-point spring probe crown scrubs away solder ball oxides. Center probe contact forces are 9g to 12g per contact for 0.5 mm to 0.65 mm pitches and 17g to 20g for 0.8 mm pitches and greater. Operating temperature ranges from -55°C to 150°C. Price for a 100-lead molded BGA socket rated up to 3 GHz starts at $450 each. For further information, conyact Frank Folmsbee at ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.
Company: ARIES ELECTRONICS INC.
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