Electronic Design

Single-Chip Platform Targets Bluetooth Headsets

An advanced silicon and software platform from Broadcom Corp. aims to improve the user experience of wireless mono and stereo headsets. The audio portfolio features two single-chip solutions that support Bluetooth Version 2.0 with EDR (upgradeable to Bluetooth Version 2.1) and Broadcom's SmartAudio sound enhancement technology. The chips are the BCM2047, optimized for high-end headsets, and the BCM2044 for basic headsets.

The BCM2047 includes the industry's most powerful multi-core architecture for Bluetooth audio products, according to Broadcom. For premium sound quality in a single-chip headset, the device integrates a digital signal processor powered by an ARM AudioDE data engine. With sufficient performance to handle stereo and audio compression algorithms (SBC, MP3, and AAC), the DSP architecture is optimized for Broadcom's SmartAudio technology to deliver superior voice quality. The BCM2044 is well-suited for basic audio headsets that don't require extensive feature programmability. The ROM-based device includes the same low-power Bluetooth radio and high-quality audio architecture as the BCM2047, and also integrates a full-feature power-management unit that includes safety circuitry.

The platform, which also includes development kits and reference designs, is sampling now to early-access customers. Contact the company for prices. For more information, go to www.broadcom.com.

TAGS: Digital ICs
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