Managing heat is not only a multi-disciplinary challenge, it’s also multi-level. An IC package that’s thermally optimized doesn’t mean the entire system is good. Effective heat management at the printed-circuit-board (PCB) level doesn’t guarantee high reliability. Design and thermal analysis must be done at multiple levels, including the ICs and PCBs in the product enclosure. Computational-fluid-dynamics (CFD) software connects these levels and crosses disciplines so
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