Electronic Design UPDATE: January 29, 2003

Jan. 29, 2003
Editor's View -- Good Buzz At Last Week's Bus And Board Show by William Wong. The recent Bus and Board Show in Long Beach, Calif., looks to be a harbinger of things to come. The tone of the show was upbeat but reserved. The announcement of Advanced TCA...
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Electronic Design UPDATE e-Newsletter Electronic Design Magazine - http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ05Am0Ar January 29, 2003

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*************************ADVERTISEMENT************************** Sponsored by: Build better models to predict SI effects http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ07YS0Ar Modeling is critical to minimize SI problems today. Software tools can extract models from measurements, so make quality measurements. Learn about measurement techniques, fixturing, software tools, and how to optimize a model. Predict and prevent your SI problems. For more information, go to: http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ07YS0Ar **************************************************************** You've received this e-newsletter for one of two reasons: 1) you are a subscriber of Electronic Design magazine 2) you've signed up for it at http://www.planetee.com Please see below for unsubscribe and address-change instructions. Today's Table of Contents: 1. Welcome! 2. Editor's View -- Commentary 3. News -- From The Editors 4. Announcements: Opportunities not to be missed 5. Magazine Highlights ********************** 1. Welcome! ********************** Welcome to Electronic Design's UPDATE e-newsletter. The editors of Electronic Design will be sending you this newsletter every other week, in between the arrival of our regular issues, to enrich your reading experience. We'll use this ongoing contact to keep you abreast of the latest and the greatest. Our UPDATE e-newsletter will alert you to important events and developments that broke after our issue closed. In addition, the editors will share their views of technology, industry trends, and happenings from their unique vantage points. We'll also include any information that we believe you'll find interesting. ********************** 2. Editor's View -- Exclusive to Electronic Design UPDATE ********************** Good Buzz At Last Week's Bus And Board Show By William Wong, Embedded/Software/Systems Technology Editor The recent Bus and Board Show in Long Beach, Calif., looks to be a harbinger of things to come. The tone of the show was upbeat but reserved. The announcement of Advanced TCA (Telecom Computing Architecture) hardware and discussion of the standards were at the forefront. Although CompactPCI vendors have been hammered by the rapid telecomm decline, there appears to be good reason to hope that Advanced TCA will pick up some of the slack by moving standards into an area where proprietary solutions have been the norm. Likewise, CompactPCI seems to be gaining ground in nontelecom areas, including industrial control and military applications. No one expects the CompactPCI market to hit its past highs, due to the continuing slowness in the telecom market. But those remaining in this market will do much better this year. The VME market did suprisingly well due to diversification, and it looks to take advantage of new technology. Yet many VME markets, such as military equipment, are very conservative when it comes to changes. So, migration to switch fabrics and adoption of new hardware such as Serial ATA and USB 2.0 will be slow to moderate. A number of new board designs, such as Vista Control's Power PC-based PPC G4D, broke new ground by providing more than 30 W of conduction cooling per board. The StarFabric Trade Association PICMG 2.17 compatibility demo showed off hardware from Bustronic/Elma, Hybricon, Kaparel, and StarGen. A presentation by Todd Comins of StarGen highlighted the link between StarFarbric and PCI Express Advanced Switching, another topic that was on everyone's lips. PCI Express lacked a hardware presence, as products based on the technology are expected later in the year, and the Advanced Switching products are not expected until 2004. Still, roadmaps, presentations, and enthusiasm were in great supply. The other item of note was an announcement by Mellanox, Sky Computer, and SBS regarding Embedded InfiniBand. While the trio gave only a preliminary presentation, the companies announced their intention to define a modular InfiniBand architecture more suitable to embedded applications. ********************** 3. News -- From The Editors ********************** ***Dual Xeons Drive PICMG 2.16 Switch-Fabric Board General Micro Systems announced its new C269 Equinox at the Bus and Board Show in Long Beach, Calif. The C269 includes a pair of 3-GHz Xeon-LP processors linked by a ServerWorks Hub-Link controller. The processors have a 533-MHz front-side bus and a 512-kbyte L2 cache. The PICMG 2.16 support includes a pair of Gigabit Ethernet channels. A third 10/100BaseT channel is included for debug and control. The SAM-III expansion bus provides access to high-speed mezannine boards, such as 3D rendering or Fibre Channel links. Pricing starts at $2400. http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ07YU0At ***Embedded FreeBSD Offers An Alternative to Linux Embedded Linux is all the rage, but FreeBSD has a more liberal license than Linux's GNU General Public License. And investigating FreeBSD just got a little easier. Check out the "Embedded FreeBSD Cookbook" by Paul Cevoli. It is part of the Embedded Technology Series from Newnes (http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ07YV0Au The book examines FreeBSD from top to bottom, including Java SDK support and JSP and servlet support using Tomcat. There are plenty of code examples. It does not delve into minute details but provides a good overview of the facilities available and how to access them. ********************** 4. Announcements: Opportunities not to be missed ********************** ****International Solid-State Circuits Conference**** Power -- and more specifically, how to reduce the use of power -- is a key topic for most designers, especially at the low supply voltages that will dominate next-generation systems. The ISSCC, scheduled for Feb. 9-13 in San Francisco, will feature a number of sessions on low-power design. Other highlights will include details of advances in DRAM, flash, and magnetoresistive storage; next-generation CPUs and interfaces; ADCs; DACs; amplifiers; imaging devices; and organic and nanoscale technolgogies. For more information, go to http://lists.planetee.com/cgi-bin3/flo?y=ePD70DJhTw0EmQ0qFd0AL ****WIRELESS SHOW**** Plan to attend the 2003 Wireless Systems Design Conference & Expo, to be held Feb. 25-27 at the San Jose Convention Center, San Jose, Calif. This year, the show will feature a new systems-level view of the wireless world -- that is, the development of wireless systems from a true system level. It will focus equally on hardware and software and delve into the technical details of what today's wireless engineer needs to know to be successful. As such, WS 2003 will continue to cover technology pertaining to the traditional wireless staple -- the cell phone -- but also broaden its scope to cover various other topics under the wireless umbrella. Some of these include basestations, software-defined radios, antennas, digital signal processors, and the wireless Internet as they pertain to such applications as medical and automotive. For more information, go to http://lists.planetee.com/cgi-bin3/flo?y=ePD70DJhTw0EmQ07MC0Av ****Embedded Systems Conference**** The ESC, scheduled for April 22-26 at the Moscone Center in San Francisco, will present more than 140 conference sessions, including tracks concentrating on system-on-a-chip designs and consumer electronics. Topics will include security, WiFi, audio and video, Linux, and real-time design. For more information, go to http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ0pof0AV ****JavaOne**** Scheduled for June 10-13 at the Moscone Center in San Francisco, JavaOne is the place to be for Java related technologies, development tools, and strategies. It covers a wide range of topics from embedded Java development to enterprise Java deployment.Go to http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ07YT0As ****DESIGN BRIEFS WANTED**** Send us your ideas for design. We'll pay you $100 for every Design Brief that we publish. You can submit your ideas for Design Briefs via: * E-mail mailto:[email protected] Or by: * Ground mail Design Briefs Editor Electronic Design 45 Eisenhower Dr., 5th Floor Paramus, NJ 07562 Go to http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ05Am0Ar for our submission guidelines. ********************** 5. Magazine Highlights ********************** In case you missed them, here are some of the high points of our most recent issue, January 20, 2003. * Editorial -- A New Look And Exciting New Forums Ring In 2003 * Point Of View -- The Need For Hybrid Optimization * Cover Story -- Contract Manufacturing Swoops In On Product Design... And EE Jobs Like a hawk, contract manufacturing is spreading its wings over design and manufacturing, enveloping a product's entire cycle. * Leapfrog: Industry First -- Power Solution Takes On Next-Generation CPUs A multiphase synchronous buck-converter architecture repartitions functions in silicon to create a scalable design suitable for many phases. For the complete Table of Contents, go to http://lists.planetee.com/cgi-bin3/flo?y=ePPi0Gl4E70EmQ05Am0Ar

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CONTACTS: Electronic Design UPDATE e-NEWSLETTER

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Editorial: Lucinda Mattera, Associate Chief Editor: mailto:[email protected] Advertising/Sponsorship Opportunities: Bill Baumann, Associate Publisher: mailto:[email protected]

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