Module Makes High Speed USB Easy

May 7, 2009
Need a High Speed USB serial link? Then check out DLP Designâ??s module based on the latest chip from Future Technology Devices International (FTDI). The DLP-USB1232H has a standard 18-pin dual-inline package (DIP) form factor. The FT

Need a High Speed USB serial link? Then check out DLP Design’s module based on the latest chip from Future Technology Devices International (FTDI). The DLP-USB1232H has a standard 18-pin dual-inline package (DIP) form factor. The FTDI FT2232H is designed to handle the 480-Mbit/s High Speed USB specification, allowing the system to handle transfers up to 12 Mbaud, essentially being limited by the RS-232 transfer rate. The chip can handle bulk transfers, and it supports hardware flow control.

DLP DESIGN

FTDI

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