Electronic Design
Rugged CPU Module Offers IPC Class 3 Assembly

Rugged CPU Module Offers IPC Class 3 Assembly

Rugged, highly-integrated COM Express mini form factor board combines Intel Atom E6x0T low power processor with optional TPM security chip and Type 10 COM interface.

VersaLogic’s VL-COMm-26 exceptionally rugged COM board, based on the COM Express mini form factor (55 x 84 mm), is a highly-integrated embedded computer combining the Intel Atom E6x0T low power processor with an optional TPM security chip and Type 10 COM interface. Designed and tested for highly reliable -40º to +85ºC operation in demanding environments, including extreme temperature, impact and vibration, the board is available manufactured to IPC-A-610 Class 2 standards, while Class 3 assembly is offered for extreme reliability requirements. An 8 V to 17 V input voltage range simplifies system power supply requirements, and thermal monitoring reduces power consumption to remain within specified operating limits. A Type 10 pin-out provides Gigabit Ethernet, seven USB ports, three x1 PCIe lanes, two serial interfaces, Intel HDA, LPC, and SMBus to the carrier board. An auxiliary board-to-board connector provides two additional serial interfaces and a CAN interface. Dual SATA 3 Gb/s interfaces support high-capacity rotating or solid-state drives. A microSD socket and SDIO interface provide SSD options. The VL-COMm-26 is available from stock with prices starting at $526 for 1 GB RAM models in OEM quantities.

VERSALOGIC CORP.

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