X-ES’ XPedite8101 XMC/PMC and XPedite8150 Rugged COM Express modules, based on Intel Atom E3800 SoC processors, are designed with BIT support, class III PCB fabrication and assembly, and MIL-STD-810 qualification for reliability in demanding and long life cycle applications. Supporting up to four cores operating at up to 1.91 GHz and boasting excellent computational performance and I/O functionality for their power profile and size, E3800-based modules are ideally suited for platforms with more stringent SWaP-C and thermal constraints. The XPedite8101, available in conduction- and air-cooled configurations, supports up to 8 GB of DDR3 ECC SDRAM and up to 32 GB of SLC NAND flash, as well as a Dual-Mode DisplayPort video interface and two Gigabit Ethernet ports, and can be hosted on a number of form factors, such as 3U and 6U VPX, 3U and 6U cPCI, VME and XPand6200 SFF systems. The mini form factor (55 x 84 mm) XPedite8150 provides up to 4 GB of DDR3 ECC SDRAM and supports enhanced Type 10 pinout with one Dual-Mode DisplayPort, one Embedded DisplayPort, and two Gigabit Ethernet interfaces. The XPedite8152 provides the same SDRAM density and compatible pinout, but extends its size to 55 x 109 mm for supporting up to 32 GB of SLC NAND Flash and additional external SATA interface. Both modules can be used in the XPand6000 SFF systems and XPand1400 Series development systems.
XMC/PMC And Rugged COM Express Modules Designed For Reliability
Intel Atom E3800 SoC-based XMC/PMC and rugged COM Express modules designed with BIT support, class III PCB fabrication and assembly, and MIL-STD-810 qualification for reliability in demanding and long life cycle applications.