Accommodating IC packages such as the JEDEC MO-207 BGA with a 0.8 mm pitch and 21 x 9 arrays with up to 189 balls, the SG-BGA-6103 BGA socket exhibits a 6.5 GHz bandwidth and supports dense BGA stacked devices via a conductive elastomer contactor. The component's contact resistance is specified as 10 m? typical. It employs a precision design, which guides the IC to the exact position for connection of each ball and enlists an aluminum heat sink screw to provide compressive force. For more details and pricing, call IRONWOOD ELECTRONICS, Eagan, MN. (800) 404-0204.
Company: IRONWOOD ELECTRONICS
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