Users of the SG-BGA-6099 are said to be able to socket their 1-mm pitch, 829-ball BGA and CSP devices without any performance losses. As an example, the socket will support the AMD 16-038 chip with an 8W heat sink and 29 x 29 arrays with up to 829 balls. It exhibits a 6.5 GHz bandwidth and a typical contact resistance in the realm of 10 m?. Other features include a precision design that guides the IC to the exact position for connection of each ball and an aluminum heat sink screw to provide compressive force. The socket measures 7.5 mm high and extends 2.5 mm per side further than the IC. Pricing is $615 each/100. IRONWOOD ELECTRONICS, Eagan, MN. (800) 404-0204.
Company: IRONWOOD ELECTRONICS
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