A new single-component, thermosetting, electrically-conductive adhesive claims to provide a lead-free alternative to solder for forming SMD interconnects. Called CE 3103, the adhesive offers an ultra-fine resolution (
A new single-component, thermosetting, electrically-conductive adhesive claims to provide a lead-free alternative to solder for forming SMD interconnects. Called CE 3103, the adhesive offers an ultra-fine resolution (