In order to achieve ultra-high thermal conduction, the Supertherm 2005 two-part epoxy adhesive introduces diamonds into the mix. This smooth-paste adhesive is recommended for semiconductor die-attach and other micro electronic applications requiring high thermal conductivity and reliable insulation over a wide temperature range. Additionally, it has an extremely long pot life at room temperature and is said to exhibit strength and thermal conductivity after a brief, intensive heat cure. Other applications include chip-type electronic or surface-mounted components in printed, integrated and hybrid circuits, and for screen, dispenser or pin transfer and application methods.
Company: TRA-CON INC.
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