EE Product News

Encapsulant Draws Away Components' Heat

Excellent thermal conductivity enables the STYCAST 2850 FT epoxy encapsulant to protect embedded components from thermal shock and other forms of stress. The material allows heat to dissipate and its low coefficient of thermal expansion minimizes stress on delicate parts. The two-component black encapsulant can be used with a variety of catalysts. It also features excellent electrical insulation properties. And a blue version is recommended for use in high-voltage applications. Both versions of the encapsulant can be cured at temperatures ranging from 25°C to 125°C in as little as 30 to 60 minutes.

TAGS: Components
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