Designed for encapsulating chips and other devices, the 933-1 is a one-component, highly filled, electrically-insulating epoxy encapsulant. The formulation is said to offer a longer work life and lower moisture sensitivity than other anhydride-cured systems. It features a low coefficient of thermal expansion, which is said to minimize stress of placed on components and wiring during shock tests.
Company: TRA-CON INC.
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