Encapsulant Provides Protection For Sensors

June 1, 2000
Designed to protect stress-sensitive electronics and coil windings from harsh operating environments, the Stycast 2850FT/11 encapsulant, cured with Catalyst 11, combines a low coefficient of thermal expansion and high Tg to survive thermal cycling

Designed to protect stress-sensitive electronics and coil windings from harsh operating environments, the Stycast 2850FT/11 encapsulant, cured with Catalyst 11, combines a low coefficient of thermal expansion and high Tg to survive thermal cycling from -40°C to 150°C. Particularly suited to component found under the hood of an automobile, the encapsulant supports the electronics found in fuel sensors without compromising device integrity or reliability, it is claimed. The material can cure in as little as 30 min. or at a temperature as low as 80°C. It is available in a wide range of package configurations designed to fit high-speed meter mix equipment.

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